From Models to Materials (SL IB Chemistry)

The type of bonding and percentage ionic / covalent character of binary compounds can be deduced using triangular bonding diagrams.

Complete the table by calculating Σχ and Δχ for the given compounds.

Use section 9 of the data booklet.

Use data from sections 9 and 17 of the data booklet to percentage covalent character and bonding type in the following compounds:

Deduce the chemical that is found in the bottom left of a triangular bonding diagram by using sections 9 and 17 of the data booklet.

Poly(phenylethene) is widely used as a polymer for many purposes such as packaging. The structure of poly(phenylethene) is shown below. 

Explain why poly(phenylethene) drawn in part (a) is less reactive than Terylene described in part (b).

Substances A, B and C are located in the bonding triangle as shown.

Suggest, giving a reason, a physical property that substances A and B would have in common.

Use the bonding triangle and section 17 of the data booklet.

Substance A is an alloy containing a Group 1 metal and a Group 2 metal.

Identify the constituent metals in substance A, giving a reason.

Use the bonding triangle in (a) and section 9 of the data booklet.

Silicon tetrachloride is used to produce high purity silicon and silica for commercial applications. 

Explain whether silicon tetrachloride has a higher boiling point than substance C.

Use the bonding triangle in (a) and sections 9 and 17 of the data booklet.

The structure shows a section of a polymer found in some plastics.